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郭鴻飛

個人網站
自動化及控制研究所
 
學經歷:
  學歷:
喬治亞理工學院 電機工程博士 (01/1999-08/2004)

經歷:
ASML Center of Excellence 應用發展工程師 (04/2007-09/2009)
星雲電腦 專案經理與光學部主管 (08/2005-03/2007)
喬治亞理工學院 博士後研究 (09/2004-07/2005)


專業技術
  微影光學, 奈米光學檢測, 太陽電池
   
專利介紹
 
  增進影像清晰度的方法  
一種增進影像清晰度的方法,適於擷取多重對焦影像並使用影像融合技術成一張最佳清晰度影像,包括以下步驟。......
 
     
研究計畫
 

教授課程

偏微分方程在工程上之應用
機電光系統光學訊號處理
微積分

 Publications

  • Z. R. Huang, D. Guidotti, L. Wan, Y. J. Chang, J. Yu, J. Liu, H. F. Kuo, G. K. Chang, F. Liu, and R. R. Tummala, “Hybrid integration of end-to-end optical internnects on printed circuit boards,” IEEE Trans. Compon. Packag. Technol. Vol. 30, pp.708-715, Dec. 2007.
  • L. B. Chang, C. H. Chang, M. J. Jeng, H. C. Chiu, and H. F. Kuo, “Barrier Height Enhancement of AlxGa1-xN/GaN Schottky Diodes Prepared by P2S5/(NH4)2S Treatments,” Electrochemical and Solid-State Letters, 10 (3) H79-H81 2007.
  • G. K. Chang, D. Guidotti, Z. R. Huang, L. Wan, J. J. Yu, S. Hegde, H. F. Kuo, Y. J. Chang, F. H. Liu, F. T. Wang, and R. Tummala, “High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems,” SPIE Invited talk, FL Mar. 2005.
  • S. W. Seo, S. Y. Cho, H. F. Kuo, and N. M. Jokerst, “Optical interconnection using embedded thin film edge emitting lasers, photodetectors, and polymer waveguides,” The 2004 IEEE-LEOS summer meeting, July 2004.
  • H. F. Kuo, S. Y. Cho, and N. M. Jokerst, “Heterogeneous integration of InP/InGaAsP MQW thin film edge emitting lasers and polymer waveguides,” The 54th IEEE-ECTC, June 2004.(EI)
  • H. F. Kuo, S. Y. Cho, J. Hall, and N. M. Jokerst, “InP/InGaAsP MQW thin film edge emitting lasers for embedded waveguide chip to chip optical interconnections,” The 16th IEEE-LEOS, Annual, Oct. 2003.

Patents

  • Y. H. Yang and H. F. Kuo, “Quantum Cascaded Laser at Wavelength 10μm for Laser Engraver in XY Table,” Taiwan patent no. M313029, issued June 2007; Austria patent no. 9630, issued Feburary 2007.
  • M. Chang and H. F. Kuo, “Laser Marking Machine with Multiple Scanheads,” Germany patent no. 202007000175.4, issued February 2007; Japan patent no. 3129877, issued Feburary 2007; Taiwan patent no. M313067, issued June 2007.

   

 




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